Work In Tech

In this role, you will be engaged in all stages of a package design from architecture to feasibility studies to mass production. At the architecture stage, you will be working with cross functional teams to convey limitations and collect requirements. At the feasibility stage, you will be working on fast iterations of different design and interacting with stakeholders from silicon to system engineering. At the mass production, you will be both working with design services or will drive the production design and DFM with manufacturing partners.

This role is hybrid, based out of Toronto, Ontario, Taiwan, Austin, TX or Santa Clara, CA.

Responsibilities:

• Drive routing feasibility studies on organic substrate and 2.5D interposers
• Evaluate silicon floorplan and IP bump map proposals for different design-rule
• Work with cross functional team and collect input to define package ball-out
• Represent packaging team in cross functional meetings and articulate package technology limitations
• Design daisy chain packages for or test and qualification
• Work closely with Power and Signal Integrity engineers to come up with optimized solutions
• Work with external design services to convert feasibility studies in production design

Experience & Qualifications:

• Minimum 5 years of experience as package layout engineer (focusing on flip chip BGA packages)
• Proficiency with Cadence Allegro
• Experience in Advanced 2.5 packages (RDL/interposer)
• Familiar with packaging technology and manufacturing process
• Ability to collaborate effectively with cross-function teams
• Ability to provide design options based on incomplete or ambiguous data
• Ability to spin design quickly, automate the process, script, and do change control

Tenstorrent offers a highly competitive compensation package and benefits, and we are an equal opportunity employer.

Due to U.S. Export Control laws and regulations, Tenstorrent is required to ensure compliance with licensing regulations when transferring technology to nationals of certain countries that have been licensing conditions set by the U.S. government.

As this position will have direct and/or indirect access to information, systems, or technologies that are subject to U.S. Export Control laws and regulations, please note that citizenship/permanent residency, asylee and refugee information and supporting documentation will be required and considered as a condition of employment.

If a U.S. export license is required, employment will not begin until a license with acceptable conditions is granted by the U.S. government. If a U.S. export license with acceptable conditions is not granted by the U.S. government, then the offer of employment will be rescinded.