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R&D Engineer II - Thermal



Zhubei City, Hsinchu County, Taiwan 302
Posted on Wednesday, May 15, 2024

Summary / Role Purpose

The R&D Engineer II for foundry support contributes to the support of Ansys products enablement with worldwide foundries. In this role, the R&D engineer II will collaborate with a team of expert professionals to understand foundry technology requirements and accomplish solution enablement objectives.

Key Duties and Responsibilities

  • Performs moderately complex development activities, including the design, implementation, maintenance, testing and documentation of software modules and sub-systems

  • Understands and employs best practices

  • Performs moderately complex bug verification, release testing and beta support for assigned products. Researches problems discovered by QA or product support and develops solutions

  • Understands the marketing requirements for a product, including target environment, performance criteria and competitive issues

  • Understand foundry technology requirement, defining spec and work with RD to enable the solution.

  • Support foundry technology collaboration with Ansys solution, including certification, reference flow, and mutual customer support

  • Works under the general supervision of a development manager

Minimum Education/Certification Requirements and Experience

  • BS in Engineering, microelectronics, mechnical, or related field with 1-3 years’ experience or MS

  • Working experience with EDA solution, EDA companies, semiconductor design companies, semiconductor foundries.

Preferred Qualifications and Skills

  • Technical knowledge and experience with ASIC design flow, VLSI, RC extraction, device simulation, and/or CAD engineering.

  • Experience with Ansys tools, is a plus, but is not required.

  • Expertise in scripting languages like python, perl, TCL desired

  • Good communication and interpersonal skills

  • Ability to learn quickly and to collaborate with others in a geographically distributed team.

  • Experience in 3DIC or system-level thermal/stress simulation is a plus.